What is Advanced Packaging?
Advanced packaging integrates multiple dies, chiplets, memory and interconnect technologies into high-performance semiconductor packages. It enables higher I/O density, shorter interconnects, smaller form factors and heterogeneous integration, and is critical for AI, HPC, automotive, mobile and data center applications. ProcureVedas maps the complete advanced packaging ecosystem — from technologies and processes to materials, equipment, services and suppliers — helping you discover the companies and products driving this fast-growing market.
Explore the ecosystem
Discover key areas of the advanced packaging value chain. Click any card for a quick explanation.
Technologies
Packaging architectures for higher performance.
Processes
RDL, TSV, bonding, molding, inspection and test.
Equipment
Bonders, lithography, plating, etch, inspection and more.
Materials
Underfill, mold compound, solders, adhesives, chemicals and more.
Packaging services
OSATs, wafer bumping, assembly, test and design services.
Applications
AI, HPC, automotive, consumer, RF, photonics and more.
Advanced Packaging Explorer
Go from architecture to processes, components, suppliers and applications.
Loading hierarchy…
Fan-Out Packaging
Fan-out packaging redistributes die connections beyond the original die footprint using redistribution layers (RDL), enabling smaller, thinner packages with high I/O density.
Applications
Advanced packaging enables next-generation performance across industries.
AI / HPCAutomotiveMobile & ConsumerData CenterRF & CommunicationsIndustrial & IoTPhotonicsSpace & DefenseLatest advanced packaging intelligence
Stay updated with market trends, investments, capacity and key developments.